MediaTek Dimensity 1050 mmWave 5G, Dimensity 930 5G and Helio G99 4G 6nm SoCs announced | What Cel

admin May 22, 2022
Updated 2022/05/22 at 10:35 PM
7 Min Read

MediaTek today announced Dimensity 1050, its first mmWave 5G chipset for next generation of 5G smartphones. It combines mmWave 5G and sub-6GHz to fluidly migrate between network bands, and is built TSMC 6nm production process. The company said that it will be capable of delivering up to 53% faster speeds and greater reach to smartphones compared to LTE + mmWave aggregation alone.

In addition, it has MediaTek’s HyperEngine 5.0 gaming technology, UFS 3.1 storage and LPDDR5 memory. This looks like a toned down version of the Dimensity 1100, but with a different Mali-G610 GPU, similar to Dimensity 8000 series.

MediaTek Dimensity 1200 vs 1100 vs 1050 specifications
Dimensity 1200 Dimensity 1100 Dimensity 1050
Process 6nm TSMC
CPU 1x Cortex-A78 @ 3GHz 3x Cortex-A78 @ 2.6GHz
4x Cortex-A55 @ 2GHz
4x Cortex-A78 @ 2.6GHz
4x Cortex-A55 @ 2GHz
4x Cortex-A78 @ 2.5GHz
4x Cortex-A55 @ 2GHz
Memory 2X LPDDR4x, up to 16GB, dual-channel UFS 3.1 LPDDR5, LPDDR4X, UFS 3.1, UFS 2.1
Camera 32MP+16MP, 200MP, Multi-camera, HDR-ISP (3+2) / Video HDR / Video NR / Video Bokeh / Video EIS / AI-Shutter / AI-AE / AI-AF / AI-AWB / AI-NR HDR / AI-HDR / AI-FD 32MP+16MP, 108MP, Multi-Camera, HDR-ISP (3+2) / Video HDR / Video NR / Video Bokeh / Video EIS / AI-Shutter / AI-AE / AI-AF / AI-AWB / AI-NR HDR / AI-HDR / AI-FD 20MP+20MP, 108MP, Dual HDR video capture hardware 3X HDR-ISP MFNR 3DNR AINR Hardware Depth Engine Warping Engine
Display 2520 x 1080 (Full HD+) at 21:9 168Hz, QHD+ at 90Hz 2520 x 1080 (Full HD+) at 21:9 144Hz, QHD+ at 90Hz 2520 x 1080 (Full HD+) at 21:9 144Hz
Video Playback / Video Encode H.264, H.265 / HEVC, VP-9, AV1 / H.264, H.265 / HEVC
Graphics Mali-G77 MC9 Arm Mali-G610 MC3
Modem True Dual 5G SIM (5G SA + 5G SA) modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD Band, NR FDD Band, DSS, NR DL 2CC, 200 MHz bandwidth, 4×4 MIMO, 256QAM NR UL 2CC, 2×2 MIMO, 256QAM VoNR / EPS fallback Sub-6GHz (FR1), mmWave (FR2), 2G-5G Multi-Mode, 5G-CA, 4G-CA, 5G FDD / TDD, 4G FDD / TDD, TD-SCDMA, WDCDMA, EDGE, GSM

SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, FR1 TDD+FDD, DSS, FR1 DL 3CC up to 200 MHz, FR2 DL 4CC up to 400MHz, 256QAM FR1 UL 2CC, 256QAM VoNR / EPS fallback

Connectivity Integrated Wi-Fi 6 (a/b/g/n/ac/ax), Bluetooth 5.2, GPS L1CA+L5 / BeiDou B1I+ B2a / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA+ L5 / NavIC, FM Radio

Smartphones powered Dimensity 1050 are expected in the third quarter of 2022.

Mediatek Dimensity 930

The company also introduced the Dimensity 930 which actually has Cortex-A78 cores clocked at 2.2GHz, less than Dimensity 900 and 920, but this has new IMG BMX-8-256 GPU.

MediaTek Dimensity 930 vs 920 vs 900 specifications
Processor Dimensity 930 Dimensity 920 Dimensity 900
Process 6nm TSMC
CPU 2x Cortex-A78 @ 2.2GHz
6x Cortex-A55 @ 2GHz
2x Cortex-A78 @ 2.5GHz
6x Cortex-A55 @ 2GHz
2x Cortex-A78 @ 2.4GHz
6x Cortex-A55 @ 2GHz
Memory LPDDR4x, LPDDR5, UFS 2.1,UFS 2.2, UFS 3.1
Camera 64MP, 108MP, Hardware video HDR, 3X HDR-ISP, MFNR, 3DNR, AINR, Hardware Depth Engine, Warping Engine 20MP+20MP, 108MP, Hardware video HDR, 3X HDR-ISP, MFNR, 3DNR, AINR, Hardware Depth Engine, Warping Engine
Display 2520 x 1080 (Full HD+) at 21:9 120Hz
Video Playback / Video Encode H.264, H.265 / HEVC, VP-9, AV1 / H.264, H.265 / HEVC
Graphics IMG BXM-8-256 Mali-G68 MC4
Modem True Dual 5G SIM (5G SA + 5G SA) modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD Band, NR FDD Band, DSS, NR DL 2CC, 200 MHz bandwidth, 4×4 MIMO, 256QAM NR UL 2CC, 2×2 MIMO, 256QAM VoNR / EPS fallback
Connectivity Integrated Wi-Fi 6 (a/b/g/n/ac/ax), Bluetooth 5.2, GPS L1CA+L5 / BeiDou B1I+ B2a / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA+ L5 / NavIC

Smartphones powered Dimensity 930 are expected in the second quarter of 2022.

MediaTek Helio G99

The Helio G99 is a 4G chip which promise more than 30% power savings for gaming compared to the Helio G96 since this uses SMC N6 (6nm-class) chip production process compared to 12nm. It also has slightly higher clock speeds.

Processor  Helio G99  Helio G96
Process TSMC 6nm TSMC 12nm
CPU 2x Cortex-A76 @ 2.2GHz
6x Cortex-A55 @ 2GHz
2x Cortex-A76 @ 2.05GHz
6x Cortex-A55
Memory 2X LPDDR4x Up to 2133MHz, eMMC 5.1 / UFS 2.2
Camera 16MP+16MP, 108MP, 32MP @ 30fps ZSL; 16MP + 16MP @ 30fps3X ISP; AI Face Detection; HW depth engine; AINR; Single-Cam/Dual-Cam Bokeh; Hardware Warping Engine (EIS); Rolling Shutter Compensation (RSC) engine; MEMA 3DNR; Multi-Frame Noise reduction; 26MP+16MP, 108MP, 32MP @ 30fps ZSL; 16MP + 16MP @ 30fps ZSL;
3X ISP; AI Face Detection; HW depth engine; AINR; Single-Cam/Dual-Cam Bokeh; Hardware Warping Engine (EIS); Rolling Shutter Compensation (RSC) engine; MEMA 3DNR; Multi-Frame Noise reduction
Display 2520 x 1080 (Full HD+) at 21:9 120Hz
Video Decode / Video Encode 2160p (2160 x 1080), h.264, h.265 / HEVC 4K 30fps, FHD 120fps, HD 240fps
Graphics Arm Mali-G57 MC2
Modem Cat-13 DL, 4G Carrier Aggregation (CA), CDMA2000 1x/EVDO Rev. A (SRLTE), 4G FDD / TDD, HSPA +, 4X4 MIMO, 2CC CA, 256QAM, TAS 2.0, HPUE, IMS (VoLTE\ViLTE\WoWi-Fi), eMBMS, Dual 4G VoLTE (DSDS), Band 71
Connectivity Integrated Dual-Band Wi-Fi 5 (a/b/g/n/ac), Bluetooth 5.2, GPS / QZSS L1+ L5 / Galileo E1 + E5a / BeiDou B1C + B2a / NAVIC
Availability

Smartphones powered by the Dimensity 930 are expected during this second quarter of 2022 and smartphones with Dimensity 1050 and the Helio G99 are expected in the third quarter of 2022.

Source


Author: Srivatsan Sridhar

Srivatsan Sridhar is a Mobile Technology Enthusiast who is passionate about Mobile phones and Mobile apps. He uses the phones he reviews as his main phone. You can follow him on Twitter and Instagram
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